Infineon BSP317P: High-Performance P-Channel Power MOSFET for Advanced Switching Applications

Release date:2025-10-21 Number of clicks:104

Infineon BSP317P: High-Performance P-Channel Power MOSFET for Advanced Switching Applications

The relentless pursuit of higher efficiency and power density in modern electronics demands superior switching components. Addressing this need, the Infineon BSP317P stands out as a high-performance P-Channel Power MOSFET engineered to excel in a wide array of advanced switching applications. This device encapsulates Infineon's expertise in power semiconductor technology, offering a compelling blend of low losses, robust performance, and integration-friendly packaging.

A key highlight of the BSP317P is its exceptionally low on-state resistance (RDS(on)) of just 70 mΩ. This critical parameter is paramount for minimizing conduction losses, which directly translates into higher system efficiency, reduced heat generation, and the potential for more compact designs by requiring smaller heat sinks. This low RDS(on) is achieved through Infineon's advanced trench technology, ensuring optimal current handling in a small form factor.

Complementing its low conduction losses is the MOSFET's superior switching performance. The BSP317P is characterized by its fast switching speeds, which are crucial for high-frequency applications such as switch-mode power supplies (SMPS), DC-DC converters, and motor drive circuits. This capability allows designers to increase switching frequencies, thereby reducing the size of passive components like inductors and capacitors and further enhancing the power density of the end product.

Housed in a space-saving SOT-223 package, the BSP317P offers an excellent balance between power handling and board space requirements. This makes it an ideal choice for power management tasks in space-constrained applications, including battery protection circuits, load switches, and power distribution in consumer electronics, telecom hardware, and computing systems. The package is designed for effective thermal management, reliably dissipating heat under demanding operating conditions.

Furthermore, the device features a logic-level gate drive, simplifying the driving circuitry. This allows for direct control from microcontrollers (MCUs) or low-voltage logic circuits without the need for complex level-shifting components, streamlining design and reducing the overall bill of materials (BOM) cost.

ICGOOODFIND: The Infineon BSP317P is a top-tier P-Channel MOSFET that delivers high efficiency through low RDS(on) and excellent switching characteristics. Its SOT-223 packaging and logic-level gate make it a versatile and designer-friendly solution for enhancing performance in modern power conversion and management systems.

Keywords: Low RDS(on), Power MOSFET, Switching Performance, SOT-223 Package, Logic-Level Gate.

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